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DTSTART;TZID=Europe/Rome:20260420T090000
DTEND;TZID=Europe/Rome:20260420T094500
LOCATION:Room Auditorium
CREATED:20260421T174602
DTSTAMP:20260421T174602
SUMMARY:OK01 Opening Keynote "It’s Time to Futureproof our Prosperity by Superfueling Innovation, Enabling Next-Gen AI"
URL;VALUE=URI:https://date26date-conference.com/programme#OK01
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DESCRIPTION:Get the latest session information at 
	https://date26date-conference.com/programme#OK01\n\n\nThe AI field is 
	evolving at an incredibly fast pace, with major models and updates being 
	released almost every month. As these models evolve beyond Large Language 
	Models towards next-gen AI with advanced reasoning capabilities, compute 
	systems struggle to handle the heterogeneous workloads in a performant and 
	sustainable way. However, developing new, AI-optimised compute 
	architectures and the enabling semiconductor technologies takes much more 
	time than writing algorithms. To prevent bottlenecks slowing down AI-based 
	advancements, we must reinvent compute architectures and semiconductor 
	technology platforms.\nThe presentation will shed light on the need for 
	flexible, versatile compute architectures implemented in flexible, 
	versatile technology platforms while addressing the increasing challenges 
	of density, power and memory. To speed up both advanced semiconductor 
	technology R&D and full stack innovation for future AI applications, imec 
	is expanding its pilot line infrastructure under the EU Chips Act. Next to 
	new infrastructure, imec aims to boost innovation through intensified 
	collaborations with complementary knowledge partners and through further 
	internationalisation, attracting global talent and building strong, local 
	ecosystems for diverse application domains, like health and 
	automotive.\nTransformative innovations for humankind hinge on the 
	innovation pace of the semiconductor industry. It’s time to supercharge 
	our innovation engine, it’s time to futureproof our prosperity.\nThe 
	presentation will shed light on the need for flexible, versatile compute 
	architectures implemented in flexible, versatile technology platforms 
	while addressing the increasing challenges of density, power and memory. 
	To speed up both advanced semiconductor technology R&D and full stack 
	innovation for future AI applications, imec is expanding its pilot line 
	infrastructure under the EU Chips Act. Next to new infrastructure, imec 
	aims to boost innovation through intensified collaborations with 
	complementary knowledge partners and through further internationalization, 
	attracting global talent and building strong, local ecosystems for diverse 
	application domains, like health and automotive.\n\nTransformative 
	innovations for humankind hinge on the innovation pace of the 
	semiconductor industry. It’s time to supercharge our innovation engine, 
	it’s time to futureproof our prosperity.
X-ALT-DESC;FMTTYPE=text/html:<!DOCTYPE HTML PUBLIC "-//W3C//DTD HTML 3.2//EN"><HTML><HEAD><META 
	NAME="Generator" CONTENT="MS Exchange Server version 
	16.0.17231.20290"><TITLE></TITLE></HEAD><BODY><p>Get the latest session 
	information at <a 
	href="https://date26date-conference.com/programme#OK01">https://date26date-conference.com/programme#OK01</a></p><div>The 
	AI field is evolving at an incredibly fast pace, with major models and 
	updates being released almost every month. As these models evolve beyond 
	Large Language Models towards next-gen AI with advanced reasoning 
	capabilities, compute systems struggle to handle the heterogeneous 
	workloads in a performant and sustainable way. However, developing new, 
	AI-optimised compute architectures and the enabling semiconductor 
	technologies takes much more time than writing algorithms. To prevent 
	bottlenecks slowing down AI-based advancements, we must reinvent compute 
	architectures and semiconductor technology platforms.The presentation will 
	shed light on the need for flexible, versatile compute architectures 
	implemented in flexible, versatile technology platforms while addressing 
	the increasing challenges of density, power and memory. To speed up both 
	advanced semiconductor technology R&D and full stack innovation for future 
	AI applications, imec is expanding its pilot line infrastructure under the 
	EU Chips Act. Next to new infrastructure, imec aims to boost innovation 
	through intensified collaborations with complementary knowledge partners 
	and through further internationalisation, attracting global talent and 
	building strong, local ecosystems for diverse application domains, like 
	health and automotive.Transformative innovations for humankind hinge on 
	the innovation pace of the semiconductor industry. It’s time to 
	supercharge our innovation engine, it’s time to futureproof our 
	prosperity.The presentation will shed light on the need for flexible, 
	versatile compute architectures implemented in flexible, versatile 
	technology platforms while addressing the increasing challenges of 
	density, power and memory. To speed up both advanced semiconductor 
	technology R&D and full stack innovation for future AI applications, imec 
	is expanding its pilot line infrastructure under the EU Chips Act. Next to 
	new infrastructure, imec aims to boost innovation through intensified 
	collaborations with complementary knowledge partners and through further 
	internationalization, attracting global talent and building strong, local 
	ecosystems for diverse application domains, like health and 
	automotive.Transformative innovations for humankind hinge on the 
	innovation pace of the semiconductor industry. It’s time to supercharge 
	our innovation engine, it’s time to futureproof our 
	prosperity.</div></BODY></HTML>
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