BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//DATE2026//date-conference.com//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
BEGIN:VEVENT
DTSTART;TZID=Europe/Rome:20260421T110000
DTEND;TZID=Europe/Rome:20260421T123000
LOCATION:Room Auditorium
CREATED:20260421T174602
DTSTAMP:20260421T174602
SUMMARY:FS04 Focus Session: Chiplets - How far from Making Promise a Reality? (Panel)
URL;VALUE=URI:https://date26date-conference.com/programme#FS04
BEGIN:VALARM
TRIGGER:-PT15M
ACTION:DISPLAY
DESCRIPTION:Reminder
END:VALARM
DESCRIPTION:Get the latest session information at
https://date26date-conference.com/programme#FS04\n\n\nThe future of
chiplets is defined by modularity, scalability, and accelerated innovation
in silicon design. As compute demands grow more specialized, the adoption
of chiplets will make it possible to combine best-in-class
components—each optimized for a specific function—into flexible,
high-performance systems. This approach has the potential to reduce
development time and cost while enabling greater customization across a
wide range of markets. With growing ecosystem support and standardization,
chiplets are paving the way for a more agile and collaborative era of
semiconductor innovation. However, multiple challenges remain in making an
open chiplet marketplace a reality, including interface standardization,
simulation, security, and thermal and packaging considerations. This focus
session will bring together organisations and companies working at
different levels in the chiplet supply chain, to discuss how they are
tackling some of these challenges, both individually and collaboratively,
and what all of this means for the DATE community.
X-ALT-DESC;FMTTYPE=text/html:Get the latest session
information at https://date26date-conference.com/programme#FS04
The
future of chiplets is defined by modularity, scalability, and accelerated
innovation in silicon design. As compute demands grow more specialized,
the adoption of chiplets will make it possible to combine best-in-class
components—each optimized for a specific function—into flexible,
high-performance systems. This approach has the potential to reduce
development time and cost while enabling greater customization across a
wide range of markets. With growing ecosystem support and standardization,
chiplets are paving the way for a more agile and collaborative era of
semiconductor innovation. However, multiple challenges remain in making an
open chiplet marketplace a reality, including interface standardization,
simulation, security, and thermal and packaging considerations. This focus
session will bring together organisations and companies working at
different levels in the chiplet supply chain, to discuss how they are
tackling some of these challenges, both individually and collaboratively,
and what all of this means for the DATE community.
UID:DATE-FS04-20260421T110000-20260421T123000
END:VEVENT
BEGIN:VTIMEZONE
TZID:Europe/Rome
TZURL:http://tzurl.org/zoneinfo/Europe/Rome
X-LIC-LOCATION:Europe/Rome
BEGIN:DAYLIGHT
TZOFFSETFROM:+0100
TZOFFSETTO:+0200
TZNAME:CEST
DTSTART:19810329T020000
RRULE:FREQ=YEARLY;BYMONTH=3;BYDAY=-1SU
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:+0200
TZOFFSETTO:+0100
TZNAME:CEST
DTSTART:19961027T030000
RRULE:FREQ=YEARLY;BYMONTH=10;BYDAY=-1SU
END:STANDARD
BEGIN:STANDARD
TZOFFSETFROM:-001444
TZOFFSETTO:+0000
TZNAME:WET
DTSTART:19010101T000000
RDATE:19010101T000000
END:STANDARD
END:VTIMEZONE
END:VCALENDAR