BEGIN:VCALENDAR VERSION:2.0 PRODID:-//DATE2025//date-conference.com//EN CALSCALE:GREGORIAN METHOD:PUBLISH BEGIN:VEVENT DTSTART;TZID=Europe/Paris:20250401T083000 DTEND;TZID=Europe/Paris:20250401T123000 LOCATION:St Clair 2 CREATED:20250320T120824 DTSTAMP:20250320T120824 SUMMARY:W02 Heterogeneous Integration: from advanced 3D technology to innovative computing architectures URL;VALUE=URI:https://date25.date-conference.com/programme#W02 BEGIN:VALARM TRIGGER:-PT15M ACTION:DISPLAY DESCRIPTION:Reminder END:VALARM DESCRIPTION:Get the latest session information at https://date25.date-conference.com/programme#W02\n\n\nWorkshop Description\n \n 3D technologies are becoming more and more pervasive in digital architectures, as a strong enabler for heterogeneous integration. With the limits of current sub-nanometric technologies, 3D integration technology is paving the way to a wide architecture scope, with reduced cost, reduced form factor, increased energy efficiency, allowing a wide variety of heterogeneous architectures. Due to the high amount of required data and associated memory capacity, ML and AI accelerator could benefit of 3D integration not only for HPC, but also for the edge and embedded HPC. 3D integration and associated architectures are opening a wide spectrum of system solutions, from chiplet-based partitioning for High Performance Computing to various sensors such as fully integrated image sensors embedding AI features, but also but also for next generation of computing architectures: AI accelerators, InMemoryComputing, Quantum, etc.\n \n The goal of the 3D Integration Workshop is to bring together experts from both academia and industry, interested in this exciting and rapidly evolving field, in order to update each other on the latest state-of-the-art, exchange ideas, and discuss future challenges.\n \n This half-day event consists of a plenary keynote, invited talks, and a panel.\n \n Workshop Committee\n \n - Pascal Vivet, CEA-List, FR, Co-general Chair\n - Dragomir Milojevic, IMEC/ULB, BE, Co-general Chair\n - Gianna Paulin, AXELERA AI, CH, Co-program Chair\n - Peter Ramm, Fraunhofer EMFT, DE, Co-program Chair\n \n Technical Program\n \n 8:30 : Workshop opening\n \n 8:30 - 9:00 : Keynote\n \n Session Chair : Pascal Vivet, CEA-Leti, FR\n \n “Status of High-End Performance Packaging (2.5D & 3D) - Technology and Market Trends”\n \n Stefan Chitoraga, Yole Group, France\n \n 9:00 - 10:00 : Session 1 : Chiplet and 3D solutions for Automotive, Space and AR/VR applications\n \n Session Chair : Gianna Paulin, Axelera AI, CH\n \n - “Challenges of future automotive electronics and solutions for the early evaluation of chiplet-based system concepts”, Peter Schneider, Fraunhofer IIS & TU Dresden, DE\n - “3D/2.5D Heterogeneous Circuits for Space and Automotive”, Fady Abouzeid, STMicroelectronics, FR\n - “Advancing Space Electronics with Chiplet-Based Architectures”, Denis Dutoit, CEA-List, FR\n - “Opportunities for 3D Integration to Enable Augmented Reality Glasses”, Tony WU, META, USA\n \n 10:00 - 11:00 : Coffee Break\n \n 11:00 - 12:00 : Session 2 : Advanced system integration for Quantum processors, and Innovative 3D Design Flows\n \n Session Chair : Peter Ramm, Fraunhofer EMFT, DE\n \n - “Heterogeneous integration technology in large-scale trapped ion quantum processors”, Bassem Badawi, University of Innsbruck, AT\n - “3D implementation flows for multi-die Logic-on-Logic & CMOS2.0”, Dragomir Milojevic, Univ ULB & IMEC, BE\n - “Addressing Thermal and Stress Effects in 3D ICs”, Nermeen Hossan, SIEMENS EDA, Egypt\n - “PPAT assessment for multi-core SOC in 2D and 3D using electro-thermal co-simulation flow”, Selim Abou Samra, CADENCE, FR\n \n 12:00 - 12:30 : PANEL\n \n « Heterogeneous Integration for an open European Chiplet Ecosystem »\n \n Panel chairs : Pascal Vivet, Gianna Paulin\n \n Panelists :\n \n - Peter SCHNEIDER, Fraunhofer IIS-EAS, DE\n - Dragomir MILOJEVIC, Université Libre de Bruxelles, IMEC, Leuven, BE\n - Denis DUTOIT, CEA-LIST, FR\n - Fady ABOUZEID, STMicroelectronics, FR\n - Stefan CHITORAGA, YOLE, FR\n \n Past editions:\n \n The 3D Integration workshop took place from 2009 to 2015, and restarted in 2022.\n \n DATE 2009 https://past.date-conference.com/date09/conference/workshop-W5\n \n DATE 2010 https://past.date-conference.com/date10/conference/workshop-W5 (broken link)\n \n DATE 2011 https://past.date-conference.com/date11/conference/workshop-W5 (broken link)\n \n DATE 2012 https://past.date-conference.com/date12/conference/workshop-W5\n \n DATE 2013 https://past.date-conference.com/date13/conference/workshop-W5\n \n DATE 2014 https://past.date-conference.com/date14/conference/workshop-W5\n \n DATE 2015 https://past.date-conference.com/date15/conference/workshop-W05\n \n DATE 2022 https://date22.date-conference.com/workshop/w02\n \n DATE 2023 https://date23.date-conference.com/workshop/w02\n \n DATE 2024 https://date24.date-conference.com/workshop/w02 X-ALT-DESC;FMTTYPE=text/html:

Get the latest session information at https://date25.date-conference.com/programme#W02

Workshop Description

3D technologies are becoming more and more pervasive in digital architectures, as a strong enabler for heterogeneous integration. With the limits of current sub-nanometric technologies, 3D integration technology is paving the way to a wide architecture scope, with reduced cost, reduced form factor, increased energy efficiency, allowing a wide variety of heterogeneous architectures. Due to the high amount of required data and associated memory capacity, ML and AI accelerator could benefit of 3D integration not only for HPC, but also for the edge and embedded HPC. 3D integration and associated architectures are opening a wide spectrum of system solutions, from chiplet-based partitioning for High Performance Computing to various sensors such as fully integrated image sensors embedding AI features, but also but also for next generation of computing architectures: AI accelerators, InMemoryComputing, Quantum, etc.

The goal of the 3D Integration Workshop is to bring together experts from both academia and industry, interested in this exciting and rapidly evolving field, in order to update each other on the latest state-of-the-art, exchange ideas, and discuss future challenges.

This half-day event consists of a plenary keynote, invited talks, and a panel.

Workshop Committee

Technical Program

8:30 : Workshop opening

8:30 - 9:00 : Keynote

Session Chair : Pascal Vivet, CEA-Leti, FR

“Status of High-End Performance Packaging (2.5D & 3D) - Technology and Market Trends”

Stefan Chitoraga, Yole Group, France

9:00 - 10:00 : Session 1 : Chiplet and 3D solutions for Automotive, Space and AR/VR applications

Session Chair : Gianna Paulin, Axelera AI, CH

10:00 - 11:00 : Coffee Break

11:00 - 12:00 : Session 2 : Advanced system integration for Quantum processors, and Innovative 3D Design Flows

Session Chair : Peter Ramm, Fraunhofer EMFT, DE

12:00 - 12:30 : PANEL

« Heterogeneous Integration for an open European Chiplet Ecosystem »

Panel chairs : Pascal Vivet, Gianna Paulin

Panelists :

Past editions:

The 3D Integration workshop took place from 2009 to 2015, and restarted in 2022.

DATE 2009 https://past.date-conference.com/date09/conference/workshop-W5

DATE 2010 https://past.date-conference.com/date10/conference/workshop-W5 (broken link)

DATE 2011 https://past.date-conference.com/date11/conference/workshop-W5 (broken link)

DATE 2012 https://past.date-conference.com/date12/conference/workshop-W5

DATE 2013 https://past.date-conference.com/date13/conference/workshop-W5

DATE 2014 https://past.date-conference.com/date14/conference/workshop-W5

DATE 2015 https://past.date-conference.com/date15/conference/workshop-W05

DATE 2022 https://date22.date-conference.com/workshop/w02

DATE 2023 https://date23.date-conference.com/workshop/w02

DATE 2024 https://date24.date-conference.com/workshop/w02

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